FEP Film

For Semiconductor Release & Insulation Service

Size Min 12.5µm
Release Non-Stick Face
Etch Bondable Surface
UV High Transmission

Description

FEP Film is a Transparent, Melt-Processable Fluoropolymer Film for Demanding Industrial Insulation And Release Applications. It Combines Resistance to a Wide Range of Industrial Chemicals With Weatherability, Electrical Insulation, a Low-Friction, Non-Stick Surface. Heat-Sealable, Weldable, Thermoformable, It Forms Wire and Cable Insulation, Composite Release Layers, Chemical-Resistant Barriers, Protective Linings, Fabricated Components for Semiconductor, Chemical-Processing, Laboratory Equipment.

Features

• Ultra-Thin Gauge
• Flexible Roll Form
• Sodium-Etched Side
• Non-Stick Release Face
• Low Dielectric Constant
• UV Transmission Rating

Benefits

• Clean Part Separation
• Extended Service Life
• Low Contamination Risk
• Minimal Media Residue
• Easy Visual Inspection
• Reliable Adhesive Bonds

Advantage

• Custom Cut To Order
• Semiconductor-Grade
• Bond & Release Sides
• Precision Slit Widths
• Multi-Purpose Material

Applications

Chemical Processing Barrier Liners; Protective Film
Wire & Cable Insulation Wraps; Core Wrapping
Instrumentation Sight Windows; UV Lamp Jackets
Electronics FPC Stacks; Polyimide Laminates
Composite Mfg Release Layers; Vacuum Bag Film
General Industry Heat-Sealable Pouch Film; Release
Semiconductor Release Liners; Process Protection Film

We Supply Transparent FEP Film for Semiconductor Release & Insulation, Send Your Width, Length & Quantity For a Quote.

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